Interests
- Microelectronic devices
- Finite element method
- Machine learning
Latest
- Accelerated Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
- Iterative computational homogenization for transient thermal problems in representative volume elements
- Effective Medium Approximation in Investigating Heat Transfer Through Multiple Sandwiched Layers of BEOL Materials
- Multiscale Simulations for 3D Chip Design
- A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
- Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
- Experimental Evaluation of Thermal Conductivity of Single Layer of BEOL Materials Using 3$ømega$ Method
- Anisotropic Thermal Resistance Characterization Using 3$ømega$ Joule Heating Thermometry and Scanning Thermal Microscopy
- Multiscale modeling of thermal behavior in 3D chiplet stacks