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Theodorian Borca-Tasciuc

Accelerated Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
Investigating Fluid Immersion for Improved Thermal Conductivity Measurement Sensitivity via Scanning Thermal Microscopy With Wollaston Probe
Investigating Fluid Immersion for Scanning Thermal Microscopy Thermal Conductivity Sensitivity Improvement
Effective Medium Approximation in Investigating Heat Transfer Through Multiple Sandwiched Layers of BEOL Materials
Multiscale Simulations for 3D Chip Design
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
Experimental Evaluation of Thermal Conductivity of Single Layer of BEOL Materials Using 3$ømega$ Method