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Zongmin Yang
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Effective Medium Approximation in Investigating Heat Transfer Through Multiple Sandwiched Layers of BEOL Materials
Multiscale Simulations for 3D Chip Design
A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
Experimental Evaluation of Thermal Conductivity of Single Layer of BEOL Materials Using 3$ømega$ Method
Anisotropic Thermal Resistance Characterization Using 3$ømega$ Joule Heating Thermometry and Scanning Thermal Microscopy
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