Paper-Conference

Accelerated Transient Multiscale Workflow for Thermal Analysis of 3DHI Chip Stack
Modern package designs make use of technologies such as backside power delivery (BSPD) and 3D stacked chiplets that require accounting …
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Spatially Continuous Functional Expansion Tallies on Unstructured Meshes
Functional expansion tallies (FETs) have become a popular method to generate tallies from Monte Carlo simulations which are spatially …
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Effective Medium Approximation in Investigating Heat Transfer Through Multiple Sandwiched Layers of BEOL Materials
Thermal management of semiconductor devices is becoming more challenging with the progressing technology nodes. Implementation of …
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A Multiscale Workflow for Thermal Analysis of 3DI Chip Stacks
Thermally aware design of 2.5 D and 3 D advanced packaging systems will require fast, accurate, and powerful thermal analysis of …
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Experimental Cross-Plane Thermal Transport Characterization of BEOL Materials and Sensitivity to In-Plane Thermal Transport
This work reports the experimental measurements of cross-plane thermal conductivities of individual BEOL films, using 3ω technique with …
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Benesh: Choreographic Coordination for In-Situ Workflows
The growing scale of high-performance computing systems increasingly enables scientists to develop more complex applications as in situ …
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Using Hierarchical Parallelism to Accelerate the Solution of Many Small Partial Differential Equations
This paper presents efforts to improve the hierarchical parallelism of a two scale simulation code. Two methods to improve the GPU …
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